RIE/ICP - Trion - Status: Available
||The Trion etcher is load lock equipped and operated via a touch screen interface. The user may employ either RIE (Reactive Ion Etching) RF power applied at the sample stage or ICP (Inductively Coupled Plasma) RF power applied at the shower head above the sample stage. The system is configured to use both chlorinated and fluorinated gases to perform a wide variety of etch recipes. The following gasses are available for use on the Trion etcher: O2, CHF3, CF4, Ar, BCl3, Cl2, and SF6.
Reactive-Ion Etching wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryJan 19, 2023 - Resource Status Up - up from cooling loss
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