DRIE - Deep RIE, STS - Status: Available
||One hour prior notice is required for the operation of this machine
The STS DRIE is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only.Â Â The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE CHAMBER.
Bosch Process wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryMar 1, 2023 - Resource Status Up - chiller flush complete...tool is back up
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