Material Safety Data Sheets
| Hydrochloric acid |
Acid |
| Hydrofluoric acid |
Acid |
| Phosphoric Acid |
Acid |
| Acetic Acid |
Acid |
| Nitric Acid |
Acid |
| Sulfuric Acid |
Acid |
| VM651 |
Adhesion Promoter |
| HMDS |
Adhesion Promoter |
| Ammonium Hydroxide |
Base |
| CRF-440 |
Cleaning Solution |
| AZ 400K |
Developer, Alkaline |
| AZ® 300 MIF |
Developer, Alkaline |
| Xylene |
Developer, Solvent |
| Microchem PMGI 101A Developer |
Developer, Solvent |
| SU-8 Developer |
Developer, Solvent |
| MIBK:IPA |
Developer, Solvent |
| Chlorobenzene |
Developer, Solvent |
| CF4 (20%) Oxygen (80%) |
Gases, Mixed |
| Hydrogen (4%) Nitrogen (96%) |
Gases, Mixed |
| Octafluorocyclobutane (C4F8) |
Gases, Pure |
| Ammonia (NH3) |
Gases, Pure |
| Boron trichloride (BCl3) |
Gases, Pure |
| Helium |
Gases, Pure |
| Trifluoromethane (CHF3) |
Gases, Pure |
| Methane (CH4) |
Gases, Pure |
| Nitrogen (N2) |
Gases, Pure |
| Sulfur hexafluoride (SF6) |
Gases, Pure |
| Hydrogen (H2) |
Gases, Pure |
| Diborane (B2H6) |
Gases, Pure |
| Nitrous Oxide (N2O) |
Gases, Pure |
| Oxygen (O2) |
Gases, Pure |
| Dichlorosilane (SiH2Cl2) |
Gases, Pure |
| Chlorine (Cl2) |
Gases, Pure |
| Argon (Ar) |
Gases, Pure |
| PI-2611 |
General |
| 777 Etch |
General |
| PDMS - Sylgard 184 Silicone Elastomer |
General |
| PI-2574 |
General |
| WL-5351 PHOTOPATTERNABLE SPIN-ON SILICONE |
General |
| Copper Etch APS-100 |
General |
| Lead zirconate titanate (PZT) |
Other Film |
| Hydrogen Peroxide Solution 30% |
Oxidizer |
| Microchem SU-8 2000 series |
Photoresists, Neg |
| WL-5351 Silicone |
Photoresists, Neg |
| ma-N 2400 Negative Tone Photoresist |
Photoresists, Neg |
| Futurrex NR9-1500 |
Photoresists, Neg |
| AZ nLOF 2000 Series |
Photoresists, Neg |
| Microchem LOR A |
Photoresists, Pos |
| Microchem LOR B |
Photoresists, Pos |
| MICROPOSIT S1813 |
Photoresists, Pos |
| AZ 9260 Photoresist (520 CPS) |
Photoresists, Pos |
| ZEP 520A |
Photoresists, Pos |
| PMMA in Anisole |
Photoresists, Pos |
| Chrome etchant type 1020 |
Pre-mixed Etch |
| Buffered oxide etch (BOE) 6:1 |
Pre-mixed Etch |
| Gold etchant type TFA |
Pre-mixed Etch |
| Aluminum etchant 80:15:3:2 |
Pre-mixed Etch |
| Tris(dimethylamino)silane, 99+% |
Precursor, ALD |
| Pentakis(dimethylamino)tantalum(V), 99% |
Precursor, ALD |
| Tetrakis(dimethylamino)hafnium, 98+% (99.99+%-Hf, <0.2%-Zr) TDMAH |
Precursor, ALD |
| Tetrakis(dimethylamino)titanium(IV), 99% TDMAT |
Precursor, ALD |
| (Trimethyl)methylcyclopentadienylplatinum(IV), 99% |
Precursor, ALD |
| Trimethylaluminum, min. 98% |
Precursor, ALD |
| Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru) |
Precursor, ALD |
| PG Remover |
Resist Remover |
| EBR PG |
Resist Remover |
| AZ EBR 70/30 |
Solvent |
| Microchem G-thinner |
Solvent |
| Acetone |
Solvent |
| Methyl Isobutyl Ketone (MIBK) |
Solvent |
| Toluene |
Solvent |
| Dichlorobenzene |
Solvent |
| BTS-220 (PGMEA) |
Solvent |
| Methanol |
Solvent |
| Anisole |
Solvent |
| Microchem P-thinner |
Solvent |
| Isopropanol |
Solvent |