Wafer Bonder, EVG 501 - Status: Available
  • Current Status: Available
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $49.50/Hour
    • External Affiliated Commercial/Industrial: $49.50/Hour
    • External Commercial/Industrial: $66.00/Hour
    • External International Academic: $66.00/Hour
    • Internal Standard: $33.00/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
  • Building: NANO (0070)
  • Room: Cleanroom, Hot Processing (166)
  • In Cleanroom: Yes
  • Main Contact: Marco Downing

Wafer Bonding wiki link
Microfabrication wiki link
Latest Status Log EntrySep 15, 2023 - Resource Status Up - Exhaust is back.
Capabilities Training Prerequisites Calendar Contacts Docs

Available only for thermal compression bonding up to 500C for 4" wafers. Precise alignment of wafer samples requires the use of the EVG620 aligner.

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