Wafer Bonder, EVG 501 - Status: Available
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Wafer Bonding wiki link Microfabrication wiki link Latest Status Log EntryNov 29, 2022 - User Note: the machine worked till 6pm yesterday and I let it cool down to 9 am today. |
Available only for thermal compression bonding up to 500C for 4" wafers. Precise alignment of wafer samples requires the use of the EVG620 aligner.
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