Wafer Bonder, EVG 501 - Status: Available
Wafer Bonding wiki link
Microfabrication wiki link
Latest Status Log EntrySep 15, 2023 - Resource Status Up - Exhaust is back.
Available only for thermal compression bonding up to 500C for 4" wafers. Precise alignment of wafer samples requires the use of the EVG620 aligner.
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