Wafer Bonder, EVG 501 - Status: Available
  • Current Status: Available
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $49.50/Hour
    • External Affiliated Commercial/Industrial: $49.50/Hour
    • External Commercial/Industrial: $66.00/Hour
    • External International Academic: $66.00/Hour
    • Internal Standard: $33.00/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External)
  • Building: NANO (0070)
  • Room: Cleanroom, Hot Processing (166)
  • In Cleanroom: Yes
  • Main Contact: Marco Downing

Wafer Bonding wiki link
Microfabrication wiki link
Latest Status Log EntryNov 29, 2022 - User Note: the machine worked till 6pm yesterday and I let it cool down to 9 am today.
Capabilities Training Prerequisites Calendar Contacts Docs

Available only for thermal compression bonding up to 500C for 4" wafers. Precise alignment of wafer samples requires the use of the EVG620 aligner.

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