Dicing Saws- ADT - Status: Down
||Fully automatic programmable dicing saw
Wafer Dicing wiki link Latest Status Log EntryMar 24, 2020 - Resource Status Down - C19 shutdown
The ADT dicing saw is an advanced, fully programmable microprocessor controlled saw intended to be used for cutting wafer thin materials into smaller component pieces. Typically silicon wafers are diced but any thin material can be cut with the correct configuration and blade type. The maximum thickness is only limited by the blades that are available.
The NRF stocks blades that are intended for use on silicon wafer die separation, users may consult with staff for direction on how to purchase blades for other materials.
The maximum wafer diameter is 6" for this saw.