DRIE - Oxford Plasma Pro - Status: Available
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The Oxford Plasma Pro 100 is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only. The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE CHAMBER.
Bosch Process wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntrySep 14, 2023 - Resource Status Up - exhaust is back...tool is back up
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