DRIE - Oxford Plasma Pro - Status: Available
||One hour prior notice is required for the operation of this machine
The Oxford Plasma Pro 100 is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only. The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE CHAMBER.
Bosch Process wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryJan 19, 2023 - Resource Status Up - up from cooling loss
|Training Topic||Description||Rates||Approx Session Length (hrs)|
|Deep RIE Oxford Training||Standard Rate: $62.00/Complete User Training||N/A|
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