Flexus 2320 - Status: Available

The Flexus 2320 determines wafer curvature by measuring the angle of deflection of a laser beam off the surface 6”, 4”, 3” and 2” diameter substrates. Film stress is determined by comparing the change in radius of curvature of the substrate, with and without the film.

Radius of curvature wiki linkLatest Status Log EntryJan 4, 2021 - Resource Status Up - recover from holiday break

The Flexus 2320 determines wafer curvature by measuring the angle of deflection of a laser beam off the surface 6”, 4”, 3” and 2” diameter substrates. Film stress is determined by comparing the change in radius of curvature of the substrate, with and without the film.