The DWL 66FS is a high precision, maskless pattern generator for direct laser writing of photosensitive materials at 405nm. Substrates may be masks, silicon, glass, etc. as long as it is relatively flat. Features of the NRF system: • Minimum feature size: 1.0 microns using 4mm write head • Minimum feature size: 5.0 microns using 20mm write head • Substrate size: up to 9 x 9 inches • Diode Laser, 405nm, 60mW • conversion software for GDSII, CIF, DXF, and Gerber file formats • Metrology and overlay alignment system with macro and micro camera • Arbitrary structures on the substrate can be used for the alignment • X-Y-stage with linear motors and 8” x 8” write area • Wafer/mask vacuum chuck for single plates up to 9” x 9” • Optical Autofocus using 4mm write head • Pneumatic focus for 20mm write head


To Request Mask Fabrication:
1.___Read "Instructions for photomask CAD file submittal" in the "Docs" page (click "Docs" above)
2.___Email the CAD file and "Staff Processed Photomask Request" form (found by clicking the "Docs" tab above) to Bill Lewis
3.___"Request Service" on the main page of this web site
Before you request a mask, please read pages 1-4 and Section 2.0 of the Laser Writer, Heidelberg SOP found by clicking the "Docs" tab above


Pre-coated Mask Blank Prices
5" Soda Lime/chrome=$26, 5" Soda Lime/iron oxide=$49
*The use of the developer station (not tracked/charged) is built into the charge rate.

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