Trion RIE/ICP - Status: Down
  • Current Status: Down
  • Use Rates:
    • External Academic & Government: $72.00/Hour
    • External Affiliated Commercial/Industrial: $72.00/Hour
    • External Commercial/Industrial: $96.00/Hour
    • External International Academic: $96.00/Hour
    • Internal Standard: $48.00/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour
  • Building: NANO (0070)
  • Room: Cleanroom, Dry Etch (162)
  • In Cleanroom: Yes
  • Main Contact: David Hays
 The Trion etcher is load lock equipped and operated via a touch screen interface. The user may employ either RIE (Reactive Ion Etching) RF power applied at the sample stage or ICP (Inductively Coupled Plasma) RF power applied at the shower head above the sample stage. The system is configured to use both chlorinated and fluorinated gases to perform a wide variety of etch recipes. The following gasses are available for use on the Trion etcher: O2, CHF3, CF4, Ar, BCl3, Cl2, and SF6.

Reactive-Ion Etching wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryAug 24, 2017 - Resource Status Down - down for pump issue
Capabilities Training Prerequisites Calendar Contacts Docs

The Trion etcher is load lock equipped and operated via a touch screen interface. The user may employ either RIE (Reactive Ion Etching) RF power applied at the sample stage or ICP (Inductively Coupled Plasma) RF power applied at the shower head above the sample stage. The system is configured to use both chlorinated and fluorinated gases to perform a wide variety of etch recipes. The following gasses are available for use on the Trion etcher: O2, CHF3, CF4, Ar, BCl3, Cl2, and SF6.