FIB/SEM - FEI Helios G4 PFIB CXe dual beam - Status: Available

  • Current Status: Available
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $100.50/Hour
    • External Affiliated Commercial/Industrial: $193.50/Hour
    • External Commercial/Industrial: $258.00/Hour
    • External International Academic: $134.00/Hour
    • Internal Standard: $67.00/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
  • Building: NANO (0070)
  • Room: Dual-Beam Fib (132)
  • In Cleanroom: No
  • Main Contact: Nicholas Rudawski

The FEI Helios G4 PFIB CXe DualBeam system integrates focused ion and scanning electron beams for FIB and SEM functionality in one instrument.

Instrument Specifications:

  • Elstar UC+ SEM column; 0.3 - 30 kV operating voltage with <1 nm resolution
  • Field-free (high-resolution) and immersion (ultrahigh-resolution) SEM modes
  • Schottky field emission gun electron source
  • Plasma FIB 2.0 column; 2 - 30 kV operating voltage; 1 pA - 2.5 uA beam currents
  • Xe plasma ion source
  • Everhart-Thornley and through lens detectors; configurable for SE+BSE or BSE only imaging
  • In-situ Pt deposition GIS
  • In-situ C deposition GIS
  • EasyLift in-situ micromanipulator
  • EDAX Octane Elite (70 mm squared active area) SDD energy dispersive spectroscopy system
  • EDAX Velocity CMOS EBSD camera
  • EDAX TEAM and APEX EDS and EBSD acquisition and analysis software
  • EDAX OIM 8 texture and crystallographic analysis software
  • Auto Slice and View serial sectioning software

  • Zoom workshop on dual beam FIB/SEM tips, tricks, and other useful info (recorded 11/19/21)

    EBSD Tutorial using EDAX Velocity EBSD camera and TEAM

    PFIB lamella prep tutorial


    1. Please create an RSC user account with a PI-approved funding source.

    2. Please complete RSC general safety training.

    3. Please complete the FIB Knowledge Training course through eLearning; submit a training request using the "Training" link at the bottom of the page and follow the instructions to be added to the course; you must complete this course regardless of any prior coursework or operational experience related to SEM or FIB you may have.

    Latest Status Log EntrySep 20, 2023 - User Note: Did some test Pt depositions with the I-beam at 12 kV; recommend targeting ~5 pA/um^2 current density; gives a nice, smooth Pt strap

    • Ga-free S/TEM lamella preparation via in-situ lift-out method
    • Rapid, large scale (>100 um) cross-section face preparation
    • High-resolution (<1 nm) top-down and cross-sectional SEM imaging
    • Nanoscale (<100 nm) to microscale (>1 um) electron and ion beam-assisted milling, patterning, and deposition
    • Automated serial sectioning and cross-section face imaging
    • Nanoscale (<100 nm) to microscale (>1 um) compositional analysis using EDS
    • Nanoscale (<100 nm) to microscale (>1 um) texture and crystallographic analysis using EBSD

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