Litho Process Karl Suss MA6 - Status: Available

Description: The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in four modes; hard contact, soft contact, vacuum and proximity. It can accommodate exposure of irregularly shaped substrates and standard wafers to 6”. Features: Contact 1:1 aligner. DUV and IR capability Approximate Exposure Intensity: 8 mW/cm2@365 nm, 5 mW/cm2@405 nm Constant exposure intensity controller Two mask holder sizes are available, 4" and 5". Wafer size is 4" and pieces. Maximum wafer thickness 4.3mm Split field microscope for top-side viewing/alignment. resolution = down to .8um in vacuum contact mode @ 400nm

The use of the developer station (not tracked/charged) is built into the charge rate.

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Description: The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in four modes; hard contact, soft contact, vacuum and proximity. It can accommodate exposure of irregularly shaped substrates and standard wafers to 6”. Features: Contact 1:1 aligner. DUV and IR capability Approximate Exposure Intensity: 8 mW/cm2@365 nm, 5 mW/cm2@405 nm Constant exposure intensity controller Two mask holder sizes are available, 4" and 5". Wafer size is 4" and pieces. Maximum wafer thickness 4.3mm Split field microscope for top-side viewing/alignment. resolution = down to .8um in vacuum contact mode @ 400nm

The use of the developer station (not tracked/charged) is built into the charge rate.