Litho Process Karl Suss MA6 - Status: Available
  • Current Status: Available
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $68.25/Hour
    • External Affiliated Commercial/Industrial: $68.25/Hour
    • External Commercial/Industrial: $91.00/Hour
    • External International Academic: $91.00/Hour
    • Internal Standard: $45.50/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
  • Building: NANO (0070)
  • Room: Cleanroom, Photolithography (165)
  • In Cleanroom: Yes
  • Main Contact: Bill Lewis
 Description: The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in four modes; hard contact, soft contact, vacuum and proximity. It can accommodate exposure of irregularly shaped substrates and standard wafers to 6”. Features: Contact 1:1 aligner. DUV and IR capability Approximate Exposure Intensity: 8 mW/cm2@365 nm, 5 mW/cm2@405 nm Constant exposure intensity controller Two mask holder sizes are available, 4" and 5". Wafer size is 4" and pieces. Maximum wafer thickness 4.3mm Split field microscope for top-side viewing/alignment. resolution = down to .8um in vacuum contact mode @ 400nm

The use of the developer station (not tracked/charged) is built into the charge rate.

Photolithography wiki link
Photoresist wiki link
Microfabrication wiki linkLatest Status Log EntryJul 8, 2024 - Resource Status Up - ....lamp was off and WEC stage was hitting the wafer holder. Turned lamp on and leveled the WEC stageand tool worked fine. Last user also had way too much rotation on the wafer holder. Tool is back up
Capabilities Training Prerequisites Calendar Contacts Docs
Title
Equipment ImageDownload
Liftoff - S1813 Image ReversalDownload
Litho Process, Karl Suss MA6 SOPDownload
NRF Lithography Processes SOPDownload

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