Litho Process Karl Suss MA6 - Status: Available
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Description: The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in four modes; hard contact, soft contact, vacuum and proximity. It can accommodate exposure of irregularly shaped substrates and standard wafers to 6”.
Features:
Contact 1:1 aligner.
DUV and IR capability
Approximate Exposure Intensity: 8 mW/cm2@365 nm, 5 mW/cm2@405 nm
Constant exposure intensity controller
Two mask holder sizes are available, 4" and 5".
Wafer size is 4" and pieces.
Maximum wafer thickness 4.3mm
Split field microscope for top-side viewing/alignment.
resolution = down to .8um in vacuum contact mode @ 400nm
The use of the developer station (not tracked/charged) is built into the charge rate. Photolithography wiki link Photoresist wiki link Microfabrication wiki linkLatest Status Log EntryJul 8, 2024 - Resource Status Up - ....lamp was off and WEC stage was hitting the wafer holder. Turned lamp on and leveled the WEC stageand tool worked fine. Last user also had way too much rotation on the wafer holder. Tool is back up |
Use Prerequisites
Prerequisite | Description | Status |
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Computer Access | Requires computer access be setup | Check Your Status |
Funding Source | Requires permission to an active funding source | Check Your Status |
Work Plan | Requires a work plan be approved by PI and staff | Check Your Status |
Agreement Form | Requires completed agreement form for equipment usage | Check Your Status |
RSC Safety Training | Requires completion of safety training | Check Your Status |
NRF Building Access | Requires issue of an id badge and entry badge and/or access level to be set. | Check Your Status |
Equipment Training | Requires completion of equipment training | Check Your Status |
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