Litho Process Karl Suss MA6 - Status: Available
||Description: The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in four modes; hard contact, soft contact, vacuum and proximity. It can accommodate exposure of irregularly shaped substrates and standard wafers to 6”.
Contact 1:1 aligner.
DUV and IR capability
Approximate Exposure Intensity: 8 mW/cm2@365 nm, 5 mW/cm2@405 nm
Constant exposure intensity controller
Two mask holder sizes are available, 4" and 5".
Wafer size is 4" and pieces.
Maximum wafer thickness 4.3mm
Split field microscope for top-side viewing/alignment.
resolution = down to .8um in vacuum contact mode @ 400nm
The use of the developer station (not tracked/charged) is built into the charge rate.
Photolithography wiki link
Photoresist wiki link
Microfabrication wiki linkLatest Status Log EntrySep 14, 2023 - Resource Status Up - exhaust is back...tool is back up
|Computer Access||Requires computer access be setup||Check Your Status|
|Funding Source||Requires permission to an active funding source||Check Your Status|
|Work Plan||Requires a work plan be approved by PI and staff||Check Your Status|
|Agreement Form||Requires completed agreement form for equipment usage||Check Your Status|
|RSC Safety Training||Requires completion of safety training||Check Your Status|
|NRF Building Access||Requires issue of an id badge and entry badge and/or access level to be set.||Check Your Status|
|Equipment Training||Requires completion of equipment training||Check Your Status|
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