RIE/ICP, Unaxis SLR - Status: Available

  • Current Status: Available
  • Use Rates:
    • External Academic & Government: $72.00/Hour
    • External Affiliated Commercial/Industrial: $72.00/Hour
    • External Commercial/Industrial: $96.00/Hour
    • External International Academic: $96.00/Hour
    • Internal Standard: $48.00/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour
  • Building: NANO (0070)
  • Room: Cleanroom, Dry Etch (162)
  • In Cleanroom: Yes
  • Main Contact: Bill Lewis
Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials. Features: -Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2 -Wafer Clamping and He backside cooling. 4” and 5” wafer capable. 3” and 6” capable with purchase of additional wafer clamps. -Temperature controlled chamber -2KW ICP, 600W RIE -Automatic wafer load via load lock

Reactive-Ion Etching wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryOct 19, 2017 - Resource Status Up - purged water loop to turbo. ran clean recipe 3 times without error. back up.

Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials. Features: -Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2 -Wafer Clamping and He backside cooling. 4” and 5” wafer capable. 3” and 6” capable with purchase of additional wafer clamps. -Temperature controlled chamber -2KW ICP, 600W RIE -Automatic wafer load via load lock