RIE/ICP - Unaxis SLR - Status: Available
||Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials.
-Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2
-Wafer Clamping and He backside cooling- For 4” wafers only. Pieces smaller than 75mm may be processed without backside cooling.
-Temperature controlled chamber
-2KW ICP, 600W RIE
-Automatic wafer load via load lock
Reactive-Ion Etching wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryMay 17, 2023 - Resource Status Up - adjusted wafer sensor and it seems to be working properly now
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