RIE/ICP - Unaxis SLR - Status: Available
||Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials.
-Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2
-Wafer Clamping and He backside cooling- For 4” wafers only. Pieces smaller than 75mm may be processed without backside cooling.
-Temperature controlled chamber
-2KW ICP, 600W RIE
-Automatic wafer load via load lock
Reactive-Ion Etching wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryOct 25, 2023 - User Note: chan 1 = N2
|Computer Access||Requires computer access be setup||Check Your Status|
|Funding Source||Requires permission to an active funding source||Check Your Status|
|Work Plan||Requires a work plan be approved by PI and staff||Check Your Status|
|Agreement Form||Requires completed agreement form for equipment usage||Check Your Status|
|RSC Safety Training||Requires completion of safety training||Check Your Status|
|NRF Building Access||Requires issue of an id badge and entry badge and/or access level to be set.||Check Your Status|
|Equipment Training||Requires completion of equipment training||Check Your Status|
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