RIE/ICP - Unaxis SLR - Status: Available
||Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials.
-Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2
-Wafer Clamping and He backside cooling- For 4” wafers only. Pieces smaller than 75mm may be processed without backside cooling.
-Temperature controlled chamber
-2KW ICP, 600W RIE
-Automatic wafer load via load lock
Reactive-Ion Etching wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryOct 25, 2023 - User Note: chan 1 = N2
To select the time for your reservation, click on the calendar at the desired start time and drag to the desired end time. If you are logged in, the reservations will display the names of the reservation users. Note: If the calendar is down, the following link may also be used to create a reservation: Create Reservation (Quick Form)
Please Note: This tool enforces a 30 minute buffer between reservations. This allows time for staff to prep the tool.
An active Gatorlink login is required to create a new reservation.