DRIE - Deep RIE, STS - Status: Available
  • Current Status: Available
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $74.25/Hour
    • External Affiliated Commercial/Industrial: $74.25/Hour
    • External Commercial/Industrial: $99.00/Hour
    • External International Academic: $99.00/Hour
    • Internal Standard: $49.50/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
  • Building: NANO (0070)
  • Room: Cleanroom, Dry Etch (162)
  • In Cleanroom: Yes
  • Main Contact: David Hays
 One hour prior notice is required for the operation of this machine

The STS DRIE is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only.  The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE CHAMBER.

Bosch Process wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryFeb 7, 2024 - Resource Status Up - cleaned electrode and realigned load arm. Backside cooling is normal.
Capabilities Training Prerequisites Calendar Contacts Docs

One hour prior notice is required for the operation of this machine

The STS DRIE is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only.  The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE MOT ALLOWED IN THE CHAMBER.

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