DRIE - Deep RIE, STS - Status: Available
||One hour prior notice is required for the operation of this machine
The STS DRIE is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only.Â Â The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE CHAMBER.
Bosch Process wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryMar 1, 2023 - Resource Status Up - chiller flush complete...tool is back up
To select the time for your reservation, click on the calendar at the desired start time and drag to the desired end time. If you are logged in, the reservations will display the names of the reservation users. Note: If the calendar is down, the following link may also be used to create a reservation: Create Reservation (Quick Form)
An active Gatorlink login is required to create a new reservation.