DRIE - Deep RIE, STS - Status: Available
||One hour prior notice is required for the operation of this machine
The STS DRIE is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only.Â Â The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE CHAMBER.
Bosch Process wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryMar 1, 2023 - Resource Status Up - chiller flush complete...tool is back up
|Computer Access||Requires computer access be setup||Check Your Status|
|Funding Source||Requires permission to an active funding source||Check Your Status|
|Work Plan||Requires a work plan be approved by PI and staff||Check Your Status|
|Agreement Form||Requires completed agreement form for equipment usage||Check Your Status|
|RSC Safety Training||Requires completion of safety training||Check Your Status|
|NRF Building Access||Requires issue of an id badge and entry badge and/or access level to be set.||Check Your Status|
|Equipment Training||Requires completion of equipment training||Check Your Status|
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