DRIE - Deep RIE, STS - Status: Available
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One hour prior notice is required for the operation of this machine
The STS DRIE is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only.  The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE CHAMBER. Bosch Process wiki link Plasma Etching wiki link Microfabrication wiki link Latest Status Log EntryFeb 7, 2024 - Resource Status Up - cleaned electrode and realigned load arm. Backside cooling is normal. |
| Training Topic | Description | Rates | Approx Session Length (hrs) |
|---|---|---|---|
| Deep RIE STS Training | Standard Rate: $62.00/Complete User Training | 2 |
| Start | End | Availability | Location | |
|---|---|---|---|---|
| Mon, Apr. 29, 2024 1:30 PM | Mon, Apr. 29, 2024 3:30 PM | 1 Seats out of 1 | NRF | Sign Up |
| Fri, May. 17, 2024 9:00 AM | Fri, May. 17, 2024 12:00 PM | 1 Seats out of 1 | NRF | Sign Up |
| Mon, May. 27, 2024 1:30 PM | Mon, May. 27, 2024 3:30 PM | 1 Seats out of 1 | NRF | Sign Up |
| Fri, Jun. 14, 2024 9:00 AM | Fri, Jun. 14, 2024 12:00 PM | 1 Seats out of 1 | NRF | Sign Up |
| Mon, Jun. 24, 2024 1:30 PM | Mon, Jun. 24, 2024 3:30 PM | 1 Seats out of 1 | NRF | Sign Up |
To request a training session at a custom date & time, please click an option below.
Request and Sign Up for Deep RIE STS Training | Request and Sign Up for Priority Deep RIE STS Training
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