DRIE - Deep RIE, STS - Status: In Use

  • Current Status: In Use
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $74.25/Hour
    • External Affiliated Commercial/Industrial: $74.25/Hour
    • External Commercial/Industrial: $99.00/Hour
    • External International Academic: $99.00/Hour
    • Internal Standard: $49.50/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
  • Building: NANO (0070)
  • Room: Cleanroom, Dry Etch (162)
  • In Cleanroom: Yes
  • Main Contact: David Hays
One hour prior notice is required for the operation of this machine

The STS DRIE is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only.  The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE CHAMBER.

Bosch Process wiki link
Plasma Etching wiki link
Microfabrication wiki link
Latest Status Log EntryNov 6, 2023 - User Note: Refilled oil from mist trap and installed a slow pump flapper valve
Training TopicDescriptionRatesApprox Session Length (hrs)
Deep RIE STS TrainingStandard Rate: $62.00/Complete User Training2
Mon, Dec. 11, 2023 1:30 PMMon, Dec. 11, 2023 3:30 PM1 Seats out of 1NRFSign Up
Fri, Dec. 29, 2023 9:00 AMFri, Dec. 29, 2023 12:00 PM1 Seats out of 1NRFSign Up
Mon, Jan. 8, 2024 1:30 PMMon, Jan. 8, 2024 3:30 PM1 Seats out of 1NRFSign Up
Fri, Jan. 26, 2024 9:00 AMFri, Jan. 26, 2024 12:00 PM1 Seats out of 1NRFSign Up
Mon, Feb. 5, 2024 1:30 PMMon, Feb. 5, 2024 3:30 PM1 Seats out of 1NRFSign Up

To request a training session at a custom date & time, please click an option below.

Request and Sign Up for Deep RIE STS Training | Request and Sign Up for Priority Deep RIE STS Training

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