Litho Process EVG Model 620 w/BSA - Status: Down
||The EVG 620 is a double-side mask aligner and it can be used for UV lithography on wafers of sizes up to 150mm.
The lamp is OFF (contact Staff if you need to use the tool)
Photolithography wiki link
Photoresist wiki link
Microfabrication wiki linkLatest Status Log EntryNov 23, 2021 - Resource Status Down - lamp turned off.
The EVG 620 is a double-side mask aligner and it can be used for UV lithography on wafers of sizes up to 150mm. It has options for soft contact, hard contact and proximity exposure. It has +/- 1 um front-to backside alignment accuracy and also a Bond alignment capability. Advanced notification must be sent before the machine can be used.
The DOWN Status most of the time indicates the lamp needs to be turned on. Contact NRF Staff owner by phone when you want to use the aligner.