Litho Process EVG Model 620 w/BSA - Status: Available

The EVG 620 is a double-side mask aligner and it can be used for UV lithography on wafers of sizes up to 150mm.

The lamp is OFF

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The EVG 620 is a double-side mask aligner and it can be used for UV lithography on wafers of sizes up to 150mm. It has options for soft contact, hard contact and proximity exposure. It has +/- 1 um front-to backside alignment accuracy and also a Bond alignment capability. Advanced notification must be sent before the machine can be used.

The use of the developer station(not tracked/ charged) is built into the charge rate.