ALD - Cambridge Nano Fiji 200 - Status: In Use
||Cambridge Nano Fiji 200 - ALD system with thermal, plasma, and exposure (allows for deposition in high aspect ratio features) deposition capabilities.
Atomic Layer Deposition wiki link
Microfabrication wiki link
Plasma-ald and ALD resources
Latest Status Log EntryMay 5, 2021 - User Note: Installed new Al precursor. Old one near empty. Pt valve closed.
Cambridge Nano Fiji 200 - A loadlocked ALD system with thermal and plasma deposition capabilities, 5 metal-organic precursors and up to 8" wafer sample size. The system is capable of operating in "exposure mode" which allows for deposition in high aspect ratio features.
Available Recipes: Al2O3, HfO2, AlN, Pt, Ru, TiN, TiO2, ZrO2 and SiO2.
Charge rate is per ALD run (24hr.) plus the precursor used for that run.
ALD Precursors Surcharge
Current precursors loaded:
1-Hf Valve open
2-Al Valve open
3-Zr Valve open
4-Pt Valve Closed
5-Ti Valve open
NOTE: Precursor changes need to be notified 48h in advance.