ALD - Cambridge Nano Fiji 200 - Status: Available
||Cambridge Nano Fiji 200 - ALD system with thermal, plasma, and exposure (allows for deposition in high aspect ratio features) deposition capabilities.
Atomic Layer Deposition wiki link
Microfabrication wiki link
Latest Status Log EntryMay 3, 2018 - Resource Status Up - Back up. Building exhaust maintenance.
Cambridge Nano Fiji 200 - A loadlocked ALD system with thermal and plasma deposition capabilities, 5 metal-organic precursors and up to 8" wafer sample size. The system is capable of operating in "exposure mode" which allows for deposition in high aspect ratio features.
Available Recipes: Al2O3, HfO2, AlN, Pt, Ru, TiN, TiO2, ZrO2 and SiO2.
Charge rate is per ALD run plus the precursor used for that run.
ALD Precursors Surcharge
Current precursors loaded:
1-Hf Valve open
3-Zr (Email staff prior to use. Valve open)
4-Si (Email staff prior to use. Valve open)
5-Ti (Email staff prior to use. Valve open)
NOTE: Precursor changes need to be notified 48h in advance.