ALD - Cambridge Nano Fiji 200 - Status: Available

Cambridge Nano Fiji 200 - ALD system with thermal, plasma, and exposure (allows for deposition in high aspect ratio features) deposition capabilities.

Atomic Layer Deposition wiki link
Microfabrication wiki link
Plasma-ald and ALD resources
Latest Status Log EntryDec 1, 2021 - User Note: Testing instrument after precursor manifold cleaning and valve replacement. Valves #2 and #5 replaced. Installed new Ti precursor. Tested Al 600 cycles, Hf 300 cycles and Zr 250 cycles.

Cambridge Nano Fiji 200 - A loadlocked ALD system with thermal and plasma deposition capabilities, 5 metal-organic precursors and up to 8" wafer sample size. The system is capable of operating in "exposure mode" which allows for deposition in high aspect ratio features.

Available Recipes: Al2O3, HfO2, AlN, Pt, Ru, TiN, TiO2, ZrO2 and SiO2.

Charge rate is per ALD run (24hr.) plus the precursor used for that run.
ALD Precursors Surcharge

Current precursors loaded:
0-H2O
1-Hf Valve open
2-Al Valve open
3-Zr Valve open
4-Si Valve open
5-Ti Valve open

NOTE: Precursor changes need to be notified 48h in advance.